Compute starts with the system.
Plan GPU facilities with direct-to-chip cooling and high-bandwidth networking for training and inference.
Explore approach ↗We design compute, cooling, power, and network fabric as connected parts of an AI environment. Hardware, deployment regions, and capacity are scoped for each engagement.
Plan GPU facilities with direct-to-chip cooling and high-bandwidth networking for training and inference.
Explore approach ↗Define dedicated capacity, private connectivity, and operating controls for your organization.
Explore approach ↗Bring power, cooling, network health, maintenance, and capacity planning into one operating scope.
Explore approach ↗These planning figures come from our infrastructure design envelope. They describe targets, rather than measured operating results or available capacity.
| Rack power density | 100 kW+ design capability |
|---|---|
| Cooling loop | 30–35°C direct-to-chip design |
| Heat rejection | 120 kW CDU design |
| Energy efficiency | 1.12 annualized PUE target |
Final specifications depend on the site, selected hardware, environmental conditions, and operating requirements.
Bring your model, scale, and deployment goals. Let’s map the software and infrastructure to the work.